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Microfluidic Chip Engineer​(Beijing)

2024-05-24

Job Responsibilities:

1. Microfluidic Chip Surface Treatment:Perform surface processing for silicon-based microfluidic chips, including cleaning, modification, and functionalization to ensure quality and consistency.

2. Process Optimization:Optimize surface treatment workflows to improve production efficiency and product quality, troubleshooting technical issues.

3. Material Selection & Testing:Evaluate and select surface treatment materials based on product requirements, conducting compatibility and performance tests.

4. Quality Control:Establish and implement QC standards and inspection methods to meet company and industry specifications.

5. Technical Documentation:Prepare and maintain process guidelines, SOPs, test reports, and other technical documents.

6. Cross-functional Collaboration:Work closely with R&D, production, and QA teams to ensure project success and on-time delivery.

Requirements:

1. Education:Bachelor’s degree or higher in Materials Science, Biomedical Engineering, Chemical Engineering, or related fields (preferred).

2. Experience:① 2+ years in microfluidic chip surface treatment or related fields;② Hands-on expertise in plasma treatment, CVD, PVD, semiconductor thin-film processes, lithography, and etching (process optimization experience is a plus);③Familiarity with microfluidic chip fabrication, polymer lithography, or MEMS processes (preferred).

3. Analytical Skills:Knowledge of surface characterization techniques (SEM, AFM, XPS).

4. Problem-Solving:Strong troubleshooting skills to address production challenges.

5. Teamwork:Excellent collaboration and communication skills for cross-departmental projects.

6. Language:Proficient in written and spoken English and Chinese.

How to Apply:

Send your resume to hr@weinadongli.com. HR will respond promptly!